Method of making connections to a semiconductor chip assembly

ABSTRACT

A connection component for electrically connecting a semiconductor chip to support substrate incorporates a preferably dielectric supporting structure (70) defining gaps (40). Leads extend across these gaps so that the leads are supported both sides of the gap (66, 70). The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section (72) adjacent one side of the gap and the frangible section is broken when the lead is engaged with the contact. Final alignment of the leads with the contacts on the chip is provided by the bonding tool which has features adapted to control the position of the lead.

This application is a continuation-in-part of U.S. Ser. No. 07/919,772filed on Jul. 24, 1992 now abandoned, which is a 371 of PCT/US93/06930filed Jul. 23, 1993.

TECHNICAL FIELD

The present invention relates to methods, components and apparatususeful in mounting and connecting semiconductor devices.

BACKGROUND ART

Semiconductor chips typically are connected to external circuitrythrough contacts on a surface of the chip. The contacts on the chiptypically are disposed in the regular patterns such as a gridsubstantially covering the front surface of the chip, commonly referredto as an "area array" or in elongated rows extending along each edge ofthe chip front surface. Each contact on the chip must be connected toexternal circuitry, such as the circuitry of a supporting substrate orcircuit panel. Various processes for making these interconnections useprefabricated arrays of leads or discrete wires. For example, in awirebonding process, the chip is physically mounted on the substrate. Afine wire is fed through a bonding tool. The tool is brought intoengagement with the contact on the chip so as to bond the wire to thecontact. The tool is then moved to a connection point of the circuit onthe substrate, so that a small piece of wire is dispensed and formedinto a lead, and connected to the substrate. This process is repeatedfor every contact on the chip.

In the so-called tape automated bonding or "TAB" process, a dielectricsupporting tape, such as a thin foil of polyimide is provided with ahole slightly larger than the chip. An array of metallic leads isprovided on one surface of the dielectric film. These leads extendinwardly from around the hole towards the edges of the hole. Each leadhas an innermost end projecting inwardly, beyond the edge of the hole.The innermost ends of the leads are arranged side by side at spacingcorresponding to the spacings of the contacts on the chip. Thedielectric film is juxtaposed with the chip so that the hole is alignedwith the chip and so that the innermost ends of the leads will extendover the front or contact bearing surface on the chip. The innermostends of the leads are then bonded to the contacts of the chip, as byultrasonic or thermocompression bonding. The outer ends of the leads areconnected to external circuitry.

In a so-called "beam lead" process, the chip is provided with individualleads extending from contacts on the front surface of the chip outwardlybeyond the edges of the chip. The chip is positioned on a substrate withthe outermost ends of the individual leads protruding over contacts onthe substrate. The leads are then engaged with the contacts and bondedthereto so as to connect the contacts on the chip with contacts on thesubstrate.

The rapid evolution of a semiconductor art in recent years has created acontinued demand for progressively greater numbers of contacts and leadsin a given amount of space. An individual chip may require hundreds oreven thousands of contacts, all within the area of the chip frontsurface. For example, a complex semiconductor chip in current practicemay have a row of contacts spaced apart from one another atcenter-to-center distances of 0.5 mm or less and, in some cases, 0.15 mmor less. These distances are expected to decrease progressively withcontinued progress in the art of semiconductor fabrication.

With such closely-spaced contacts, the leads connected to the chipcontacts, must be extremely fine structures, typically less than 0.1 mmwide. Such fine structures are susceptible to damage and deformation.With closely spaced contacts, even minor deviation of a lead from itsnormal position will result in misalignment of the leads and contacts.Thus, a given lead may be out of alignment with the proper contact onthe chip or substrate, or else it may be erroneously aligned with anadjacent contact. Either condition will yield a defective chip assembly.Errors of this nature materially reduce the yield of good devices andintroduce defects into the product stream. These problems areparticularly acute with those chips having relatively fine contactspacings and small distances between adjacent contacts.

It has been proposed to form a prefabricated lead assembly havinginwardly projecting leads with all of the inner ends of the leadsconnected to a common inner element. The common element typically is ametallic ring-like structure. In these structures, the inner end of eachlead is connected to the common element via a frangible section. Thecommon element thus restrains the inner ends of the leads againstrelative movement and hence inhibits bending or other deformation of theleads. After the leads have been bonded to the chip contact, the commonelement is broken away from the leads. A frangible section may beprovided at the juncture between the innermost end of each lead and theinner element. Systems of this nature are illustrated, for example, inThorpe, Jr. U.S. Pat. No. 4,756,080 and in Angelucci, Sr. et al, U.S.Pat. No. 4,380,042. Burns, U.S. Pat. Nos. 4,312,926 and 4,413,404 depicta generally similar arrangement in which the leads are multilayermetallic structures including a copper base with an overcoat of nickel.The frangible connection between the innermost end of each lead and theinner element consists solely of the nickel overcoat layer, therebyproviding a very thin, weak section.

In these arrangements, the common element electrically interconnects allof the leads. These interconnections must be eliminated after the leadshave been bonded to the chip. Thus, the common element must be pulledaway from the chip after the leads have been bonded to the contacts ofthe chip. All of the frangible elements must be broken eithersimultaneously or in a particular pattern as the common element ispulled away from the innermost ends of the leads. The need to remove thecommon element constitutes a significant drawback, inasmuch as this mustbe done without disturbing the delicate bonds between the lead ends andthe contacts on the chip. Perhaps for these reasons, systems utilizing acommon element have not been widely adopted.

Thus, despite the substantial time and effort devoted heretofore to theproblems associated with mounting and connecting of semiconductors,there have still been substantial, unmet needs for improvements in suchprocesses and in the equipment and components used to practice the same.

DISCLOSURE OF THE INVENTION

One aspect of the present invention provides a semiconductor chipmounting component. A component according to this aspect of theinvention includes a support structure having upper and lower surfacesand having a gap extending through the support structure, so that thegap extends downwardly from the upper surface to the lower surface. Thecomponent also includes plural electrically conductive leads. Each leadhas a connection section extending across the gap in the supportstructure. First and second ends of the connection section are securedto the support structure on opposite sides of the gap. The second end ofeach connection section is secured to the support structure so that thesecond end can be displaced downwardly relative to the support structureresponsive to a downward force applied to the connection section. Eachconnection section is flexible, so that the connection section can bebent downwardly when the second end of the connection section isdisplaced downwardly relative to the support structure. Thus, theconnection section of each lead will be supported at both ends by thesupport structure during positioning of the component on a semiconductorchip assembly. However, each connection section can be bent downwardlyto engage a contact on a part of the semi-conductor chip assembly afterthe component has been positioned on the part.

Most preferably, the connection sections of the leads are connected tothe support structure so that the first end of each such connectionsection is permanently connected to the support structure, whereas thesecond end of each such connection section is detachable from thesupport structure upon application of a downward force to the connectionsection. The first end of each connection section typically isconnected, by a further portion of the lead, to a terminal mounted onthe support structure.

In a typical arrangement, the component is adapted to be positioned onthe chip itself. Thus, when the component is positioned on the chip, theconnection sections of the leads will overlie contacts on the chip. Theconnection sections are bonded to the contacts on the chip. The leadsmay have terminals remote from the connection sections for connectingthe leads, and hence the contacts of the chip, to contacts on asubstrate. In the reverse arrangement, the component according to thisaspect of the invention may be adapted for positioning on the substrate,with the connection sections of the leads overlying the substrate sothat the connection sections can be bonded to the contacts of thesubstrate. The leads may be connected to the contacts on the chipthrough terminals remote from the connection sections.

Each lead may include a second end securement section attached to thesupport structure and a frangible section connecting the second end ofthe connection section with the second end securement section, so thatthe second ends of the connection sections are attached to the supportstructure through the frangible sections of the leads. The frangiblesections can be broken upon downward displacement of the connectionsections. The frangible section of each such lead may have across-sectional area smaller than the cross-sectional area of the secondend securement section and smaller than the cross-sectional area of theconnection section.

Most preferably, the connection section of each lead defines a pair ofopposed edges and the frangible section has a pair of notches extendinginwardly from such edges to define a neck having width less from thewidth of the connection section. In another arrangement, each leadincludes a relatively thick structural metal layer and a relatively thinfirst supplemental metal layer. The connection section and the secondend securement section of each lead incorporate the structural metallayer, whereas the frangible section of each lead includes the firstsupplemental metal layer but omits the structural metal layer. In yetanother arrangement, the second end of each connection section may bebonded to the support structures so that the bond may be broken upondownward displacement of the connection section, whereas the first endof each such connection section is permanently bonded to the supportstructure.

Alternatively, the frangible section of each lead may include apolymeric material. In yet another arrangement, each lead may extendonly partially across the gap in the support structure, and thecomponent may incorporate a polymeric strip associated with each leadextending co-directionally with the lead entirely across the gap. Eachsuch polymeric strip may be secured to the support structure on bothsides of the gap and the connection section of each lead may be bondedto the associated polymeric strip. In this case, the second end of eachconnection section is secured to the support structure only through theassociated polymeric strip, and the lead can be displaced downwardlyrelative to the support structure with breakage or elongation of thepolymeric strip.

According to a further aspect of the invention, the component mayinclude a flexible, continuous polymeric reinforcement in contact witheach lead at an edge of the support structure so that the polymericreinforcement will inhabit stress concentration in the lead at such edgewhen the lead is bent downwardly to engage a contact. Most preferably,the polymeric reinforcement associated with each lead includes apolymeric strip as discussed above overlying the connection section ofthe lead. Desirably, the polymeric strips associated with the variousleads are integral with a polymeric layer of the support structure.

Most preferably, the support structure is formed from dielectricmaterials such as polymeric materials, so that the support structuredoes not electrically interconnect the leads with one another. Thesupport structure may have appreciable thickness, i.e., an appreciabledistance between its upper and lower surfaces. The leads may be disposedat an appreciable distance above the lower surface of the supportstructure. For example, the support structure may include a plurality oflayers with a top layer defining the upper surface of the structure anda bottom layer defining the lower surface. The leads may be disposedabove the bottom layer. Alternatively, the component may be supportedabove the chip during the mounting process. In either case, eachconnection section is supported above the front surface of the chip bythe support structure before such connection section is displaceddownwardly to engage a contact. The component may include terminalsdisposed on the support structure. In a particularly preferredarrangement, the terminals, as well as the leads are disposed above abottom layer and the bottom layer is resilient so as to permit downwarddisplacement of the terminals.

The gap in the support structure may be formed as an elongated slot. Theconnection sections of many leads may extend across such slot. Theconnection sections extending across each such slot are disposed inside-by-side, substantially parallel arrangement. In a particularlypreferred arrangement, the component further includes an elongated busextending on the support structure alongside each elongated slot and thereleasable or second end of the connection section of each leadextending across the slot is connected to the bus by a frangibleelement. Preferably, each lead includes a frangible section and the bus,the frangible section and the connection section of each lead are formedintegrally with one another. Each lead may also include a second andsecurement section disposed between the frangible section and the bus.

Typically, the bus, as well as the leads, are formed from one or moremetallic materials. The bus serves to reinforce the support structureand leads, and maintain even more accurate positioning of the leads whenthe component is assembled to a chip. Moreover, during manufacture ofthe component, the bus can be used to provide electrical conductivityfor plating processes as, for example, in formation of terminals.

In a particularly preferred arrangement, the gap in the supportstructure may include a plurality of elongated slots. The supportstructure may have a central portion and a peripheral portion, and theslots may extend substantially around the central portion so that theslots are disposed between the central portion and the peripheralportion. A bus as aforesaid may be provided alongside each slot,desirably on the peripheral portion, so that one such bus extendsalongside each slot. Preferably, the slots are connected to one anotherto form a substantially continuous channel surrounding the centralportion, leaving the central portion of the support structure connectedto the peripheral portion only through the leads. All of the buses maybe connected to one another so that the buses cooperatively form ahoop-like structure on the peripheral portion, substantially surroundingthe slots and the central portion. In such an arrangement, the first orpermanently connected end of the connection section of each lead facestowards the central portion of the support structure and is electricallyconnected to a terminal on the central portion. During the connectionprocess, the frangible sections of the leads are broken so that theleads are detached from the peripheral portion, thereby detaching thecentral portion from the peripheral portion and leaving the peripheralportion connected to the chip. At the same time, the leads areelectrically disconnected from the buses.

In an alternative arrangement, some of the leads associated with eachslot may have their first or permanently mounted ends disposed at afirst edge of the slot and their second or releasably connected endsdisposed a second edge of the slot, whereas the remaining leadsassociated with the same slot may have the reverse arrangement, i.e.,the first end of the lead disposed at the second edge of the slot andthe second end of the lead connection section disposed at the first edgeof the slot. According to a further alternative, the gaps in the supportstructure may be relatively small holes extending through the supportstructure. One lead, or a few leads, may extend across each such hole.There may be numerous holes disposed at various locations on the supportstructure. For example, the holes, and the leads, may be disposed in anarray substantially covering the top and bottom surfaces of the supportstructure as, for example, where the component is to be used with a chipor other element having contacts in a "area array" on substantially theentirety of its front surface.

A further aspect of the invention provides methods of making connectionsto contacts on a part of a semiconductor chip assembly, such as tocontacts on a front surface of a semiconductor chip or contacts on achip mounting substrate. Methods according to this aspect of theinvention desirably include the steps of juxtaposing a connectioncomponent, such as a component described above, with the part so that abottom surface of the support structure in the component facesdownwardly, towards the surface of the part and the top surface of theconnection component faces upwardly, away from the front surface of thepart. The connection component is juxtaposed with the part so that eachcontact on the part surface is aligned with a gap in the supportstructure and so that connection sections of leads extending across thegap are disposed above the contacts. The support structure supports eachconnection section at both sides of each such gap during the juxtaposingstep, so that the connection section does not tend to bend or deform atthis stage of the process.

The method desirably further includes the step of bonding eachconnection section to a contact on the part by displacing eachconnection section downwardly so as to displace one end of each suchconnection section downwardly relative to the support structure andbring the connection section into engagement with the contact of thepart. Preferably, the bonding step is performed so as to detach one endof each connection section from the support structure during thedownward displacement of the connection section as, for example, bybreaking a frangible portion of each lead or detaching a bond betweenthe lead and the support structure as discussed above. In a particularlypreferred arrangement, the support structure has a gap in the form ofone or more elongated slots and buses along the slots serve to reinforcethe support structure prior to and during the connection step. As alsodiscussed above, the gap in the support structure may surround a centralportion of the support structure so that the central portion isinitially attached to the peripheral portion only through the leads, andthe connection step may serve to sever the central portion from theperipheral portion.

The bonding step most preferably includes the step of engaging eachconnection section with a recess in a bonding tool so that the bondingtool at least partially controls the position of the connection sectionin lateral directions transverse to the downward travel of the bondingtool.

The use of the bonding tool to guide and constrain the lead during thebonding step may be applied even where the connection component does nothave the connection sections connected to the support structure at bothends. Thus, the step of guiding the connection section of the lead withthe bonding tool may be employed even where the leads are cantileveredfrom an edge of the support structure. Most preferably, the methodsaccording to this aspect of the invention further include the step ofaligning the bonding tool with the contacts on the part, such as withcontacts of a semiconductor chip. Preferably, the step of engaging thebonding tool with the leads is performed so that the bonding toolactually brings the leads into alignment with the contacts. That is, thecontact sections of the leads may be slightly out of alignment with thecontacts, but the bonding tool moves the leads in directions transverseto the leads as the bonding tool is engaged with the leads, therebybringing each lead into alignment with the contacts. Thus, it isunnecessary to achieve exact alignment between the connection sectionsof the leads and the contacts on the part when the connection componentis first applied to the part. Any slight misalignment will be correctedby action of the bonding tool.

In one arrangement, each connection section is an elongated, strip-likestructure and the bonding tool has an elongated groove or recess in itsbottom surface. The bonding tool is positioned above each contact sothat the groove or recess extends in a preselected groove direction andextends across the top of a contact. The connection sections of theleads extend generally parallel to the groove direction, so that whenthe bonding tool is advanced downwardly to engage the lead, theconnection section of each lead is seated in the groove. If the lead isslightly out of alignment with the groove, the lead will be moved inlateral directions, transverse to the groove, until it seats in thegroove and thus becomes aligned with the contact.

Yet another aspect of the present invention provides a tool for bondingleads to contacts on a semiconductor chip, substrate or other part of asemiconductor chip assembly. A tool according to this aspect of theinvention desirably includes a generally body defining a bottom and agroove extending in a lengthwise direction along such bottom forengaging leads to be bonded. The tool desirably also includes means forconnecting the tool to a bonding apparatus so that the bottom of thetool faces downwardly. Such a tool can be used in methods as aforesaid.Most preferably, the groove has a central plane and surfaces slopingupwardly from the sides of the groove towards the central plane. Thesesloping surfaces will tend to guide a lead engaged with the tool towardsthe central plane of the groove.

Yet another aspect of the invention provides methods of makingsemiconductor connection components. Methods according to this aspect ofthe invention include the steps of providing one or more conductiveleads, each lead having an elongated connection section. The methodfurther includes the step of treating a dielectric support structure incontact with the leads so that the support structure incorporates one ormore gaps aligned with the connection sections of the leads and so thateach lead is permanently secured to the support structure at one end ofthe connection section and releasably secured to the supportingstructure at the other end of the connection section. The leads may beprovided on a sheet-like dielectric support layer and may be supportedby such layer. The step of forming the support structure may include thestep of selectively removing a part of the dielectric layer to form agap therein in alignment with the connection sections of the leads.

The step of providing the leads may include the step of forming eachlead with a fragile section in the connection section. Thus, the leadsmay be formed by plating an electrically conductive material such as ametal, preferably gold, to form elongated strips of a preselected widthwith frangible sections of a lesser width. Where the component is to beprovided with elongated buses as discussed above, the buses may beformed by plating at the same time as the leads. The dielectric layermay be formed from a polymeric material such as polyimide and the stepof selectively removing a portion of the dielectric layer may beperformed after forming the strips. That is, the strips are deposited onthe dielectric sheet and the dielectric sheet is then etched orotherwise selectively treated so as to form the gap or gaps. Afterformation of the gap or gaps, one end of each connection section remainsconnected to the dielectric sheet through the frangible section, andhence is releasably connected to the dielectric sheet. Alternatively,the leads may be formed by providing strips of a conductive structuralmaterial so that each such strip has an interruption therein, anddepositing a first supplemental material so that such supplementalmaterial overlies each strip at least in a zone of the strip includingthe interruption, so as to leave portions of the strip on opposite sidesof the interruption connected to one another by the first supplementalmaterial. Thus, the frangible section of each lead may include a sectionformed from the supplemental material. The structural material and thesupplemental material may both be metals and the supplemental materialmay be applied as a thin layer in a plating process before treating thedielectric material to form the gaps.

Alternatively, the leads may be formed by depositing strips of aconductive material, without frangible sections, on the dielectric sheetand then etching the dielectric sheet to form the gap or gaps. Thedimensions of the gap or gaps so formed are controlled so as to leaveeach lead with a relatively large first end securement section bonded tothe dielectric sheet on one side of the gap and with a relatively small,second end securement section bonded to the sheet on the other side ofthe gap, so that the end of each lead adjacent such other section can bedetached from the dielectric sheet by breaking this relatively smallbond. In this instance, there is no need to form a frangible section ineach lead.

The foregoing and other objects, features and advantages of the presentinvention will be more readily apparent from the detailed description ofthe preferred embodiments set forth below, taken in conjunction with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagrammatic plan view of a semiconductor connectioncomponent in accordance with one embodiment of the invention.

FIG. 2 is a fragmentary, diagrammatic, partially sectional viewdepicting a portion of the component illustrated in FIG. 1.

FIG. 3 is a diagrammatic, fragmentary, sectional view on an enlargedscale taken along line 3--3 in FIG. 2.

FIG. 4 is a diagrammatic plan view of a chip and another element usedwith the component of FIGS. 1-3.

FIG. 5 is a view similar to FIG. 2 but depicting the component of FIG. 2in conjunction with the components of FIG. 4 during an assembly process.

FIG. 6 is a diagrammatic side elevational view of a tool utilized in theassembly process of FIG. 5.

FIG. 7 is a diagrammatic end elevational view of the tool depicted inFIG. 6.

FIG. 8 is a fragmentary, sectional view on an enlarged scale depictingportions of the tool of FIG. 6 and the components of FIGS. 1-5 duringthe assembly process.

FIG. 9 is a view similar to FIG. 2 but depicting portions of a componentin accordance with a further embodiment of the invention.

FIG. 10 is a fragmentary, sectional view depicting portions of acomponent in accordance with yet another embodiment of the invention.

FIG. 11 is a fragmentary, sectional view depicting the component of FIG.10 in conjunction with a semiconductor chip after an assembly process.

FIG. 12 is a fragmentary, plan view depicting the component of FIG. 10.

FIGS. 13 and 14 are fragmentary, sectional views similar to FIGS. 10 and11 respectively but depicting a component in accordance with yet anotherembodiment of the invention.

FIG. 15 is a view similar to FIG. 2 but depicting a component inaccordance with a further embodiment of the invention.

FIG. 16 is a fragmentary, partially sectional perspective view depictingthe component of FIG. 15 and a chip after an assembly process.

FIG. 17, 18 and 19 are fragmentary, diagrammatic sectional viewsdepicting additional components in accordance with further embodimentsof the invention.

FIGS. 20A through 20G are diagrammatic sectional views depicting afabrication process in accordance with an embodiment of the invention.

FIGS. 21A through 21H are diagrammatic sectional views similar to FIGS.20A through 20G but depicting another fabrication process in accordancewith another embodiment of the invention.

FIG. 22 is a diagrammatic perspective view illustrating an assemblyincorporating a component according to yet another embodiment of theinvention.

FIG. 23 is a diagrammatic view depicting a plurality of components inaccordance with yet another embodiment of the invention.

FIG. 24 is a diagrammatic plan of view on an enlarged scale depictingportions of one component illustrated in FIG. 23.

FIG. 25 is a fragmentary sectional view depicting a portion of thecomponent of FIG. 24 together with other elements.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

A semiconductor connection component in accordance with one embodimentof the invention has a supporting structure 30 incorporating a flexibletop dielectric layer 32 and a bottom, compliant dielectric layer 34(FIG. 2). Body 30 is generally sheet-like and has a top surface 36defined by top layer 32 and a bottom surface 38 defined by bottom layer34. The terms "top" and "bottom" are used herein to indicate directionsrelative to the structure of the connection component itself. It shouldbe understood as referring to the frame of reference of the componentitself, and not to the ordinary, gravitational frame of reference.Likewise, the terms "upwardly" and "downwardly" should also beunderstood as referring to the frame of reference of the componentitself. Top layer 30 may be about 0.01 to about 0.1 mm thick, whereasbottom layer 34 may be about 0.05 to about 1.0 mm thick. Supportstructure 30 may be formed as part of a large, substantially continuousstrip-like tape 33 containing a plurality of such support structures.

Support structure 30 has four gaps 40 in the form of elongated slotsextending through the support structure, from the top surface 36 to thebottom surface 38. The gaps or slots 40 subdivide structure 30 into aninterior portion 42 substantially bounded by the gaps 40 and fourstrip-like outer securement elements 44 disposed outside of the gaps,the securement elements 44 being connected to the central portion 42 bybridge elements 46. As best seen in FIG. 1, the gaps or slots 40 definea generally rectangular pattern, with the slots defining the edges ofthe rectangle and the bridge elements 46 being disposed at the cornersof the rectangle.

The component also includes a plurality of central terminals 48 disposedon the central region 42 of the support structure and a plurality ofoutside terminals 50 disposed on the securement elements 44. For clarityof illustration, the drawings depict only a relatively small number ofcentral terminals 48 and outside terminals 50. In actual practice,however, there may be hundreds or even thousands of terminals. Eachcentral terminal 48 is associated with a central terminal lead 52,whereas each outside terminal 50 is associated with an outside terminallead 54. As best seen in FIG. 2, each central terminal 48 is disposedbetween top layer 32 and bottom layer 34 on the central region 42 of thesupport structure. Each of the terminals 48 is exposed at the topsurface of the component, through apertures in the top dielectric layer.The central terminal lead 52 associated with each such central terminal48 is formed integrally with that central terminal and extends from ittowards the periphery of the support structure, outwardly across one ofthe slots 40. Each central terminal lead thus includes an elongatedconnection section 56 extending across the associated gap or slot 40. Afirst end 58 of each such connection 56 lies at the first side 60 of theslot 40, at the central region 42, whereas the second end 62 of eachsuch connection section 56 lies adjacent the second, opposite side 64 ofthe slot, adjacent the securement element 44. Each central terminal lead52 also includes a first end securement section 66 extending from theassociated terminal 48 to the first end of the connection section. Thefirst end securement section and the connection section of each suchlead merge with one another at first edge 60 of gap 40. Each centralterminal lead also includes a second end securement section 70 attachedto the securement structure 44 on the second side of slot 40. Eachcentral terminal lead 52 also includes a frangible section 72 disposedbetween the second end 62 of the connection section 56 and second endsecurement section 70.

As best seen in FIG. 3, each central terminal lead includes a structuralmetal layer 74, a first supplemental metal layer 76 above the structuralmetal layer 74 and a second supplemental metal layer 78 below thestructural metal layer 74. All of these layers are present throughoutthe entirety of each central terminal lead 52, except that the secondsupplemental layer 78 and the structural metal layer 74 are interruptedat the frangible section 72. Stated another way, the frangible section72 consists only of the first supplemental layer 76. Thus, theconnection section 56 includes all three metal layers 74, 76 and 78, asdoes the second end securement section 70, whereas the interveningfrangible section 72 includes only the first supplemental layer 76. Thesupplemental metal layers are substantially thinner than the structuralmetal layer 56. The frangible section has a groove or notch 80 extendingacross the lead. As best appreciated with reference to FIG. 2, thegroove or notch 80 of each such frangible section 72 is transverse tothe direction of elongation E of the connection section 56. Because eachsuch frangible section 72 consists only the first supplemental metallayer 76, the cross-sectional area of the lead in the frangible section72 is substantially less than the cross-sectional area of the connectionsection 56 and less than the cross-sectional area of the second endsecurement section 70. As used in this disclosure, references to the"cross-sectional" areas of the leads should be understood as referringto the cross-sectional area in an imaginary cutting plane, such ascutting plane 82, transverse to the elongation direction of the lead,i.e. the cross-sectional area of the lead portion in question seen whenviewing in the elongation direction E (FIG. 2).

Structural metal layer 74 (FIG. 3) desirably is about 0.01 mm to about0.05 mm thick, whereas each of the supplemental metal layers 76 and 78desirably is about 1 micron to about 75 microns thick. In each case, thethickness is measured in the vertical direction. The width W of theconnection section 56 in the horizontal direction transverse to thethickness of the lead and transverse to the direction of elongation E ofthe connection section desirably is between 0.025 and about 0.25 mm. Thefrangible section 72 has substantially the same width but a very smallthickness, equal only to the thickness of the first supplemental layer76.

Typically, the supplemental metal layers are applied as platings orcoatings on the structural metal layer 56. Structural metal layer 74preferably is formed from a metal selected from the group consisting ofcopper, platinum, gold, nickel, aluminum, silver, alloys of these metalswith other metals and combinations of such metals and alloys. Of these,silver generally is less preferred whereas gold is more preferred. Thesupplemental metal layers may be formed from metals selected from thesame group. Gold, nickel and copper are particularly preferred assupplemental metal layers. Typically, the supplemental metal layers areformed from a different metal than the structural metal layer.

The outside terminal leads 54 are identical to the central terminalleads 52 except that the positions of the various elements in theoutside terminal leads are reversed. Thus, each outside terminal lead 54has a connection section 86 extending across one of the slots 40. Thefirst end 88 of each such connection section 86 is disposed adjacent thesecond edge 64 of slot 40, i.e., adjacent the securement element 44,whereas the second end 90 of each such connection section is disposedadjacent the first edge 60 of the slot and hence adjacent the centralregion 42 of the securement structure. The first end securement section92 of each outside lead 54 is mounted to the securement element 44,whereas the second end securement section 94 of each such lead ismounted to the central region 42 of the support structure. Each outsideterminal lead is provided with a frangible section 96 disposed betweenits second end securement section 94 and the second end 90 of itsconnection section 86. The widths and thicknesses of the variouselements in each outside lead are identical to those of the centralterminal leads discussed above.

The connection sections 56 and 86 of the various leads extend acrosseach slot 40 in a generally side-by-side array. Thus, the elongatedconnecting portions of the various leads associated with each gap orslot 40 extends substantially parallel to one another. The elongationdirections of all of these connecting portions associated with each slotare substantially transverse to the direction of elongation of the slotitself. The spacings between adjacent connection sections are selectedso that the center-to-center distances between connection sections areequal to the center-to-center distances between contacts on the chip tobe connected. Thus, the center-to-center distances between adjacentconnection sections 56 and 86 in a given slot 40, measured in thelengthwise direction of the slot, transversely to the directions ofelongation of the connection sections may be about 0.5 mm or less andmay preferably be about 0.25 mm or less. Also, the dimensions of supportstructure 30, including the distances between slots 40 are likewiseselected to match the distances between contact rows on the chip.

The connection component discussed above with reference to FIGS. 1-3 maybe utilized in conjunction with a semiconductor chip 98 seen in FIG. 4.Chip 98 may be a conventional semiconductor chip generally in the formof a rectangular solid having a generally planar front surface 99 withfour rows 100 of electrical contacts 102 disposed on such front surfaceadjacent the edges thereof. The contacts in each such row are disposedalong the longitudinal axis 140 of the row. As further discussed below,a generally rectangular collar or supporting ring 104, having agenerally planar front or top surface 106 may be employed in conjunctionwith chip 98. Ring 104 is dimensioned so as to closely surround chip 98.Also, ring 104 has the same thickness as chip 98, so that the topsurface 106 of the ring will lie substantially flush with the frontsurface 99 of the chip when the ring and the chip are disposed on a flatsupporting structure.

In one assembly process according to an embodiment of the invention,chip 98 and ring 104 are disposed on a flat surface (not shown) in theorientation illustrated in FIG. 4. The connection component is disposedatop the chip and ring as shown in FIG. 5, with the bottom surface 38 ofthe connection component support structure facing downwardly andabutting the top surfaces 99 and 106 of the chip and ring and with thetop surface 36 of the connection component support structure facingupwardly, away from the chip. The slots or gaps 40 in the connectioncomponent support structure are substantially aligned with the rows ofcontacts 102 on the chip, one such aligned slot 40 and contact row 100being illustrated in FIG. 5. Thus, the lengthwise direction of each slotextends generally parallel to the lengthwise axis 140 of the aligned rowof contacts, whereas each of the connection sections 56 and 86 extendingacross such slot extend transverse to such lengthwise axis.

The connection component may be placed on the chip using conventionalautomatic pattern recognition systems and automatic positioning elementsto assure the desired placement of the connection component relative tothe chip. Thus, the pattern recognition equipment is linked to afeedback system for controlling either the position of the chip or theposition of the connection component so as to align the slots or gaps 40with the rows of contacts on the chip, and to bring the connectionsections of the individual leads into alignment with the correctcontacts 102 themselves. Automatic positioning equipment and methods perse are well-known and hence need not be described further herein.Despite such automatic positioning equipment and methods however, therewill still be some misalignment between the connection sections and thecontacts. For example, tolerances on the size and shape of theconnection component may result in some individual leads being slightlymisaligned with the associated contacts on the chip even when otherleads are perfectly aligned. It is difficult to achieve perfectalignment of the connection sections of all the leads and all of thecontacts on the chip by adjusting the relative positions of the entireconnection component and chip. Preferably, however, any misalignment ofan individual lead connection section and the associated contact in thelateral or width-wise directions of the connection section amounts toless than about one-half the center-to-center distance between adjacentconnection sections, i.e., less than about one-half of the spacingbetween adjacent contacts on the chip. Thus, the connection sections ofthe individual leads at this stage of the process are crudely alignedwith the contacts in the lateral directions. Positioning of theconnection sections relative to the contacts on the chip in theelongation directions is considerably less critical. Because theconnection sections are elongated, each elongation section may bedisplaced from its nominal position relative to the associated contacton the chip by a considerable amount, up to about one-half the length ofthe connection section, while still leaving a portion of the connectionsection in an appropriate position for engagement with the chip contactin subsequent stages of the process.

In the next stage of the process, a bonding tool 110 is employed. Asbest seen in FIGS. 6, 7 and 8, bonding tool 110 has a generally flat,blade-like body 112 with a pair of opposed side surfaces 114 (FIG. 7) apair of vertical edges 116 (FIG. 6) and a lower edge 118 extendingbetween vertical edges 116. The tool has an elongated first groove 120aformed in lower edge 118 and extending inwardly along such lower edgefrom one vertical edges 116a to a coupling portion 130 adjacent themidpoint of lower edge 118. Groove 120 occupies substantially the entirewidth of lower edge 118. As best seen in FIG. 8, groove 120 has opposedsides 122 adjacent the opposite faces 114 of body 112, and has surfaces124 sloping upwardly from sides 122 to the central plane 126 of thegroove, midway between sides 122. Groove 120 merges with a verticalgroove 128a extending upwardly along the adjacent edge 116a of the body.Groove 128 tapers in depth so that the depth of this groove graduallydecreases towards the upper end thereof. The tool has a radius at thecorner between lower edge 118 and vertical edge 116a. The grooves 120aand 128a extend around these radii and merge with one another at suchradii.

The tool also has a generally flat coupling portion 130 extendingtransversely across lower edge 118, from one of the faces 114 to theother, midway between vertical edges 116. Coupling portion 130 defines abottom surface 131 (FIG. 8) approximately flush with the edges 122 ofgroove 120a. The bottom surface 131 has small ridges, grooves or otherroughening features (not shown). The bottom edge of the tool is alsoprovided with a second groove 120b extending lengthwise along the bottomedge 118 from coupling portion 130 to vertical edge 116b, opposite fromedge 116a. Groove 120b and edge 116b are similar to groove 120a and edge116a discussed above. Thus, a vertical groove 128b on edge 116b joinsgroove 120b. Tool 110 also has a shank 132 extending upwardly from thetop of blade-like body 112, the shank having a screw tip 134 andshoulder 136 at its upper end, remote from body 112. These features areadapted to mate with the tool holder 138 of a bonding apparatus so thatthe tool may be held in an operative position on the apparatus and sothat force and energy from the apparatus may be directed downwardlythrough the tool as discussed below. The screw tip 134 and shoulder 136are merely illustrative. The exact configuration of the features whichhold the tool to the apparatus will vary with the nature of theapparatus employed. Any such features and/or shapes which will allow thetool to meet with the particular bonding apparatus can be employed.Further illustrations of such features include bolt holes in the toolfor mating with bolts on the apparatus, bayonet locks, taper locksand/or straight shanks for engagement in a chock or collet.

In the bonding step of the assembly process, the assemblage of the chip98, ring 104 and the connection component is aligned with the body 112of tool 110 so that the elongated groove 120 is aligned with a contact102 on the chip. Such alignment can be achieved by moving the chip andother associated components relative to the bonding apparatus undercontrol of an automatic vision system or other system for monitoring theposition of the chip. The tool is oriented so that groove 120 extendssubstantially transverse to the direction of the row of contacts, i.e.,substantially transverse to the lengthwise axis 140 of the contact row(FIG. 5). The groove 120 thus is roughly aligned with the elongationdirections E of the connection sections 56 and 86 of the connectioncomponent leads overlying that particular row of contacts. However, itshould be understood that, in this embodiment, the alignment isestablished between the tool and the chip, and not between the tool andany element of the connection component. Thus, to the extent that theconnection section of a particular lead is out of alignment with theassociated contact on the chip, in a lateral direction transverse to thedirection of elongation of such lead, such lead connection section willbe out of alignment with the tool as well. Provided that the connectionsections of the leads have been crudely aligned with the contacts asdiscussed above, however, any minor remaining misalignment will becorrected by the tool itself during the next step.

Once the tool and the contact of the chip are in alignment, the tool isadvanced downwardly, in the direction indicated by arrow 142 in FIG. 5,so as to force the connection section of the most closely aligned leaddownwardly. As best appreciated with reference to FIG. 8, as theinwardly sloping surfaces 124 of grooves 120a and 120b engage theconnection section 56 of a lead, they displace the lead laterally,towards the central plane 126 of the groove and hence into preciselateral alignment with the contact 102. As the tool moves downwardlyunder the influence of forces applied by the bonding apparatus, itdisplaces the connection section 56 downwardly relative to the supportstructure 30 of the connection component. As the second end 62 of theconnection section 56 is forced downwardly, frangible section 72 breaks,thereby freeing the second end from the securement element and detachingthe same from the support structure. The first end 58 of each suchconnection section bends downwardly so that the freed connection sectioncan be forced into engagement with the aligned contact 102 by the tool.At the time the second end 62 of each connection section 56 is detachedfrom the support structure, it is already engaged with the groove 120 ofthe tool. At this time, the support provided to the second end of theconnection section to prevent lateral displacement is no longernecessary or desirable. As the tool forces the connection section intoengagement with the contact 102, heat and/or ultrasonic vibrations maybe applied by the bonding apparatus through the tool so as to cause theconnection section to bond to the contact. The lower surface 131 ofcoupling section 130 bears on the connection section of each lead toforce it against the contact. Applied vibrations may be directed alongthe lengthwise dimension of groove 120, and hence generally along thedirection of elongation of the connection section. The roughened surfaceof coupling section 130 aids in coupling the tool to the connectionsections of the lead for transmission of vibrations therebetween. In afurther embodiment, the coupling section 130 may be arranged to protrudedownwardly beyond the adjacent sections of the tool lower edge 118.

After the connection section of one lead has been bonded to a contact,the tool is retracted upwardly and advanced along the direction of theaxis 140 of the contact row. The tool is then aligned with the nextcontact, and the process is repeated. On some repetitions of the bondingoperation, the tool will engage the connection sections 86 of theoutside terminal leads 84. The tool is operated in the same manner tobond the outside terminal leads. However, the frangible section whichbreaks is on the opposite side of the slot 40.

Once this bonding process has been performed for all of the leads, thecontacts 102 are connected to the central terminals 48 and outsideterminals 50 of the securement element. The subassembly is then readyfor testing and further use. As discussed in greater detail inco-pending, commonly assigned U.S. Patent application Nos. 07/586,758,filed Sep. 24, 1990 and 07/673,020 filed Mar. 21, 1991, and in publishedInternational application W092/05582, (Application No. PCT/US91/06920),the disclosures of which are hereby incorporated by reference herein,the compliant bottom dielectric layer 34 permits displacement of theterminals 48 and 50 in the vertical direction towards the front surface99 of the chip and towards the top surface 106 of the ring. Thisfacilitates engagement of a multiplicity of the terminals with amultiplicity of test probes simultaneously. Compliant layer 34 may havethe structure shown in said earlier applications. As more fullydescribed therein, the compliant layer may incorporate holes and massesof compliant material, the masses being aligned with the terminals. Asdescribed in said co-pending applications, subassemblies incorporating aconnection component (also referred to as a "interposer") may be mountedto a substrate such as a circuit panel or semiconductor package. Theterminals 48 and 50 of the connection component are connected to contactpads on the substrate. As described in detail in said co-pendingapplications, the terminals 48 and 50 on the connection component canmove relative to the contacts 102 of the chip, typically in directionsparallel to the front surface 99 of the chip. This provides compensationfor differential expansion and contraction of the chip and substrate.

The connection component shown in FIG. 9 is similar to the componentdescribed above. It incorporates a support structure 230 having aflexible top layer 232 and a compliant dielectric bottom layer 234.However, the gaps 240 in the support structure are not formed aselongated slots, but, instead, are formed as individual holes. Theseholes 240 are substantially equally distributed over the entire surfacearea of the support structure 240. Each lead 252 is associated with onesuch hole, and each lead has a connection section 256 extending acrosssuch hole. Each such connection section has a first end 258 adjacent oneside of the hole, and a second end 262 adjacent the other side of thehole. Once again, the first end 258 of the connection section isconnected by a first end securement section 266 to a terminal 248,whereas the second end 262 of the connection section is connected to athin, frangible section 272, which, in turn, is connected to a secondend securement section 270 attached to the support structure. Thus, thesecond end 262 of the connection section is attached to the supportstructure through the frangible section 272. The terminals 248 on thestructure of FIG. 9 protrude above the top layer 232. Essentially anyterminal configuration can be employed, provided that the terminals arein electrical contact with the leads.

Components according to this embodiment of the invention can be used inessentially the same way as the components discussed above. Thesecomponents are employed with chips having contacts disposed in a "areaarray" of contacts distributed over substantially the entire area of thechip front surface. The connection component is disposed on the chipfront surface so that each contact on the chip is aligned with one holeand crudely aligned with the connection section 256 of one lead. Abonding tool as discussed above is advanced into each hole so as toengage the connection section of the associated lead. Once again, thebonding tool is aligned with the contacts on the chip. Engagement of thebonding tool with the connection section serves to bring the connectionsection into precise alignment with the contact.

A connection component according to a further embodiment of theinvention is illustrated in FIG. 10. That component 302 has a supportstructure incorporating only a single dielectric layer 332 having one ormore gaps 340 therein. A lead 352 extends along the underside of layer322. Lead 352 incorporates a connection section 356 extending across gap340. A first end securement section 366 of lead 352 is electricallyconnected to a terminal 348 and is permanently bonded to layer 322.First end securement section 366 is disposed adjacent the first end ofconnection section 356. The second end 362 of connection section 356 isconnected to a second end securement section 370 which, in turn, isreleasably bonded to the underside of layer 322. Thus, the bond betweenfirst end securement section 366 and layer 322 is considerably strongerthan the bond between second end securement section 370 and layer 322.Such differences in bond strength may be achieved in several ways. Asillustrated in FIG. 12, at least that portion of first end securementsection 366 adjacent gap 340 may have a width W greater than the width Wof the second end securement section 370.

The connection components 302 of FIG. 10 is employed in conjunction witha separate underlayer 304. Underlayer 304 consists essentially of alayer of dielectric material having gaps 306. The gaps 306 in underlayer304 are arranged in a pattern corresponding to the pattern of gaps 340in the dielectric layer of the support structure in the connectioncomponent itself. In use, the underlayer 304 is applied on the frontsurface of the chip, and connection component 302 is applied on top ofthe layer 304. Thus, as seen in FIG. 11, when used with the separatebottom layer 304, the connection component 302, and hence the connectionsections 356 of the leads are supported above the front surface of chip308. Once again, while the component is being positioned, the connectionsections 356 are supported at both sides of the gaps 340. In the bondingprocess, a bonding tool as discussed above is employed to force eachconnection section downwardly, into engagement with the contact 310 ofthe chip. In this operation, the second end securement section 370 isdetached from the dielectric support structure layer 322 of component302, whereas the first end securement section 366 and hence the firstend of connection section 356 remains attached to such layer. Statedanother way, the second end of each connection section 356 is releasedfrom its attachment with the support structure through peeling orbreakage of the bond between the second end securement section and thesupport structure, rather than by breakage of a frangible section in thelead itself. In this arrangement, the lead does not incorporate afrangible section and hence there is no need for the supplemental layersdiscussed above with reference to FIG. 3. Desirably, the connectionsection of the lead consists essentially of a metal selected from thegroup consisting of copper, gold, nickel, silver, aluminum, platinum andcombinations thereof, gold and gold alloys being particularly preferred.Essentially pure gold is especially preferred.

The component 402 illustrated in FIGS. 13 and 14 is generally similar tothe component 302 described with reference to FIGS. 10-12. However, thesupport structure includes both a top layer 422 and a bottom layer 434permanently connected together. Here again, a connection section of thelead extends across the gap 440 in the top layer of the supportstructure. The second end of section 456 is connected to a second endsecurement section 470, which section is releasably bonded to the toplayer 422 of the support structure. However, the end of section 470remote from connection section 456 is, in turn, attached to a furthersection 472 of the lead. That further section is permanently mounted tothe support structure. As seen in FIG. 14, when connection section 456is displaced downwardly, the second end 462 of the connection section,adjacent one side of the gap, is also displaced downwardly. The secondend securement section 470 peels away from the top layer 422 to permitsuch downward displacement of the second end. In this embodiment,however, the second end 462 of the connection section remains looselyattached to the support structure through the second end securementsection and the further section 472. This arrangement is generally lesspreferred than the other arrangements discussed above because the leadwill be stretched somewhat during the assembly process, in deformingfrom the configuration of FIG. 13 to the configuration of FIG. 14. Forthis embodiment, it is particularly desirable to form the leads fromgold, inasmuch as gold has excellent ductility to accommodate thestretching encountered in the assembly process.

The component 502 illustrated in FIGS. 15 and 16 has a bottom layer 534and a top layer 532 similar to those discussed above, the top layer 532being formed from a polymeric dielectric material, such as polyimide.Here, again, each lead includes a structural metal layer 574, a firstsupplemental layer 576 overlying the top surface of the structural metallayer 574 and a second supplemental metal layer 578 on the bottomsurface of layer 574. This layered metallic structure extends throughouta first end securement section 566 overlying the supporting structure,and also throughout connection section 556 and second end securementsection 570. Each lead further includes a polymeric strip 510 formedintegrally with the top layer 532 of the support structure. The topsurface of the metallic lead structure, i.e., the top surface of thefirst supplemental metal layer 576 and the underlying top surface ofstructural layer 574 are generally flat. Each polymeric strip 510closely overlies the top surface of one such metallic structure and isbonded thereto, so that each such polymeric strip becomes, in effect,part of the underlying lead. As in the component discussed above withreference to FIGS. 1-3, the second end 562 of each connection section556 is attached to the second end securement section 570 of the leadthrough a frangible section 572. Within each frangible section, themetallic structure is entirely omitted, so that the frangible sectionconsists only of the polymeric strip 510. In a variant of this approach,the topmost or first supplemental layer 576 may be continued through thefrangible section, so that the frangible section incorporates bothpolymeric strip and the relatively thin supplemental metal layer. In afurther variant, one or both of the supplemental metal layers may beomitted. The structural metal layer 574 may be entirely omitted in thefrangible section 572, or may be formed with a substantially reducedthickness and/or width in such section. The component of FIG. 15, likethe component of FIGS. 1-3, has leads extending from both sides of thegap 540. Thus, some of the frangible sections 572 are disposed adjacentone side of the gap, whereas others are disposed adjacent the other sideof the gap.

The component of FIG. 15 is assembled to a semiconductor chip 590 andring 592 in substantially the same way as the component of FIGS. 1-3. Asthe connection sections 556 of the various leads are forced downwardlyinto engagement with the contacts 594 of the chip, the portions of thepolymeric strips constituting the frangible sections 572 of the leadsbreak, thereby detaching the second ends 562 of the connection sections556 from the support structure. In the structure remaining after theleads have been bonded to the contacts (FIG. 16), each lead has asecurement section 566 secured to a part of the support structure 530and the connection section of each lead projects beyond an edge of thesupport structure. For example, the connection section 556a of one leadprojects beyond an edge 541 of the securement structure 530 at one sideof gap 540. The securement section 556b of another lead projects intogap 540 from the other side, and hence projects beyond edge 543 on theopposite side of the gap. The projecting connection section of each suchlead is flexed downwardly at and adjacent to the associated edge. Forexample, the connection section 556a is flexed downwardly at edge 541.The polymeric strips 510 and the polymeric top layer 532 of the supportstructure, formed integrally therewith, serve to reinforce thedownwardly flexed portions of the leads. In particular, the polymericstrips and polymeric top layer reinforce the metallic structures of thelead and protect it from stress concentrations.

The embodiment illustrated in FIG. 17 is similar to that described abovewith reference to FIGS. 15 and 16. Here, again, polymeric strips 610integral with the top layer 632 of the support structure extend acrossthe gap 640. However, the leads do not have discrete second endsecurement sections. Rather, the metallic structure in the connectionsection 656 of each lead terminates at the second end 662 of suchconnection section remote from the edge 643 of gap 640. Each such secondend is secured to the support structure through a portion 612 of thepolymeric strip extending from such second end to the support structure.In operation, the portion 612 of the polymeric strip disposed betweenthe second end of each connection section and the support structurebreaks when the connection section of the lead is forced downwardly intoengagement with the electrical contact of the chip. In other respects,this structure operates in substantially the same way as that describedabove with reference to FIGS. 15 and 16.

The component illustrated in FIG. 18 has connection sections 756 whichare cantilevered. That is, these connection sections project beyond edge741 of support structure 730, but the second ends 762 of such leads,remote from the edge 741 are not connected to the support structure.Stated another way, the projecting connection sections 756 of the leadsare attached to the support structure only at their respective firstends 758. Accordingly, this structure does not provide the enhancedalignment action achieved with the other embodiments in which the secondend of the lead is connected to the support structure. However, becauseeach lead incorporates a polymeric strip 710 overlying and bonded to itsmetallic structure, these leads will have the reinforcement discussedabove with reference to FIGS. 15, 16 and 17. That is, when the leads areflexed downwardly, the polymeric strips will reinforce the projectingportions of the metallic structure against stress concentration,particularly at and adjacent the edge of the support structure.

The component illustrated in FIG. 19 has the metallic structure of itsleads 852, and its terminals 848, disposed on top of the polymeric toplayer 832. Strips 810 formed integrally with the polymeric top layer 832extend outwardly beyond edge 841 beneath the metallic structure of eachlead. Thus, the metallic structure of each lead is reinforced at thejuncture of connection section 856 and first end securement section 866,i.e., at and adjacent the point where the lead crosses the edge 841 ofthe support structure. Each polymeric strip 810, however, terminatesshort of the second end 862 of the connection section, so that a portionof the connection section 856 adjacent the second end 862 has anexposed, downwardly facing metallic surface for engagement with thecontact (not shown) of the chip. When the component of FIG. 19 isengaged with a chip, the connection section 856 of each lead is flexeddownwardly, breaking the frangible section 872 as discussed above. Hereagain, the polymeric reinforcing strip 810, closely overlying and bondedto the metallic structure of the lead, reinforces the lead againststress concentration, particularly at adjacent edge 841.

As will be readily appreciated, the features of the various embodimentsdiscussed above can be combined with one another. For example, thevarious connection components illustrates and discussed above asincluding both a top layer and a bottom layer in their respectivesupport structures can be formed without the bottom layer and used witha separate bottom layer similar to that discussed above with referenceto FIGS. 10 and 11. Alternatively, the bottom layer can be omittedentirely.

A process for making a connection component incorporating a lead with afrangible section is illustrated in FIGS. 20A-20G. The process startswith a sheet of polyimide or other thin, flexible dielectric material902. The sheet has holes 904 formed therein at locations where terminalsare desired. A thin layer of copper is deposited non-selectively overthe entire sheet, so as to form thin copper layers 906 and 908 on thetop surface and bottom surface, respectively, of sheet 902, and also todeposit a thin layer of copper 910 extending through the holes 904.Using a conventional photoresist process, a heavy, structural layer ofcopper, typically about 0.01 mm to about 0.1 mm thick is appliedselectively in holes 904 to form plated "barrel" structures 912 and isalso applied selectively on bottom layer 908 so as to form elongatedstrips 914 on the bottom surface of the sheet where conductors aredesired. Strips 914 merge with the copper layer 908 on the bottomsurface of the sheet. A pattern of photoresist 907 is used inselectively forming strips 914. Resist pattern 907 incorporates a massof resist 916 covering bottom copper layer 908 at a preselected pointalong the length of each strip 914. This resist mast 916 thus forms aninterruption in each strip 914. However, the elements of strip 914 onopposite sides of this mass are interconnected by a thin web 917 ofcopper originally part of copper layer 908. A layer of a supplementalmetal, in this case gold, is then selectively applied on the same areasas the copper, i.e., on the strips 914 and on barrels 912. In the nextstage of the process (FIG. 20B), the photoresist material 907 used inthe steps discussed above is removed, and a new photoresist material 920is non-selectively applied over the entire bottom surface. The topsurface of the sheet is then subjected to an etching process of limitedduration. The limited etching process removes the thin copper layer 906from top surface of the sheet, but it does not substantially attack theplated barrels 910.

In the next stage of the process, a further photoresist 922 is appliedto the top surface of the sheet. That photoresist has holes aligned withplated barrels 912, so that the plated barrels are left uncovered.Moreover, top photoresist 922 has spaces 924. Those spaces are alignedwith the interruptions in strips 914, and hence with the thin webs 917left in each strip. As seen in FIG. 20C, each such interruption and thinweb 917 is disposed adjacent one side of space 924. In the next stage ofthe process (FIG. 20D), a mass of copper is deposited at the top of eachplated barrel 912 so as to form a terminal 926. A layer of nickel (notshown) is also deposited over this copper mass.

After the terminals 926 have been formed, the assembly is subjected to apolyimide etching step (FIG. 20E). Those areas of the polyimideunderlying spaces 924 in the top resist 922 are removed by the etchantso as to form gaps 528 in polyimide layer 906. The gaps are aligned withthe interruptions in strips 914, and hence aligned with the thin webs917 bridging these interruptions, each such interruption and thin webbeing disposed adjacent one side of the gap. The polyimide etchingprocess may be performed using well-known techniques as, for example,laser etching or plasma etching.

After the polyimide has been etched, and while the bottom resist layeris still in place, a thin layer 930 of a supplemental material, in thiscase gold, is applied on strips 914 by plating. Gold layer 930 alsocovers the thin copper webs 917 extending across the interruption ineach strip 914 (FIG. 20F). Thus, gold layer 930 extends across each suchinterruption. Following deposition of layer 930, the bottom photoresist920 is stripped from the assemblage, and the bottom surface of theassemblage is subjected to a sub-etching process similar to thatdiscussed above. This sub-etching process is sufficient to remove allexposed portions of layer 908, but does not appreciably attack thegold-covered copper in strips 914. Because thin webs 917 are uncoveredat this point, they are removed in the sub-etching process (FIG. 20G).This leaves a structure as discussed above with reference to FIG. 3.Thus, the copper structural material of the strips 914 is covered by thegold supplemental materials on its top and bottom surfaces, and thecopper structural material is interrupted at a frangible sectionadjacent one edge of gap 928. Thus, portions of the copper lead onopposite sides of each such gap are connected to one another only by athin web of the gold supplemental material 930.

In the foregoing process, the lead is supported at both ends whileforming the frangible section and also while forming the dielectricsupporting material to its final configuration, i.e., while forming thegap in the dielectric support layer. In this case, the lead is supportedby the dielectric material itself, and the dielectric material is etchedaway to form the gap. However, a reverse process could also be employed,wherein the lead is supported at both ends by a photoresist or othertemporary layer and the dielectric material is selectively deposited soas to form a structure having a gap aligned with the frangible sectionof the lead. Conversely, the gap in the dielectric support layer can beformed first, and the lead can be deposited and etched to form thefrangible section. The materials used in the process can be varied, andmay include the different structural and supplemental materialsdiscussed above.

A process for making a connection component having a permanently securedfirst end securement section and a detachable second end securementsection is schematically illustrated in FIGS. 21A through 21H. Theprocess begins with a laminate including a substantially continuousdielectric support layer 1002 of polyimide or another suitable polymerand a thin layer 1004 of copper or other suitable conductive material onthe bottom surface on the dielectric support layer 1002. Utilizingconventional masking and selective electroplating techniques, strips ofgold or other suitable lead material 1006 are deposited on copper layer1004 in a side-by-side array. Only one such strip is visible in FIG.21B. After deposition of the gold strips 1006 and removal of anytemporary masking material used for that process, a layer of photoresist1008 is deposited on the gold strips and copper layer.

Openings 1010 (FIG. 21C) are etched through polyimide layer 1002 and,desirably, through copper layer 1004 as well. One such opening 1010 isprovided for each gold strip 1006, so that the top surface of each goldstrip is exposed in one such opening. A bump contact is formed withineach such opening 1010. As seen in FIG. 21D, each such bump contactincludes a mask 1012 of a base metal such as copper in electricalcontact with the associated gold strip 1006 and an overlayer 1014 of asolderable, chemically resistant metal such as nickel, gold or alloysthereof. Following deposition of the bump contacts, photoresist layer1008 is removed and the thin copper layer 1004 is also removed from theunderside of polyimide layer 1002 except in the areas covered by goldstrips 1006. This electrically isolates the individual gold strips 1006from one another, leaving the assembly in the condition illustrated inFIG. 21E.

Next, a substantially continuous layer of a relatively soft, compliantsolder mask material 1016 is applied on the bottom surface of polyimidelayer 1002 and on strips 1006 (FIG. 21F). Using etching processes asdiscussed above in connection with FIGS. 20A through 20G, a gap 1018 isetched into polyimide support layer 1002 whereas a further gap 1020 isformed in underlayer 1016. As illustrated in FIG. 21E, the gap 1018 insupport layer 1002 overlies a connection section or part 1026 of strip1006 relatively close to one end of the strip. Thus, a relatively longfirst end securement section 1022 of each strip 1006 remains attached tosupport layer 1002 on one side of gap 1018 whereas a relatively shortsecond end securement section 1024 remains attached to layer 1002 on theother side of gap 1018. As used with reference to portions of strip1006, the terms "long" and "short" refer to the lengths of theseportions in the direction of elongation of strip 1006, i.e., in thedirections from left to right and right to left in FIG. 21G. Merely byway of example, the second end securement section 1024 may be about0.025 mm to about 0.075 mm long, as measured from the adjacent edge 1028of gap 1018 to the end 1030 of strip 1006 at the second end securementsection. The first end securement section 1022 desirably is longer thanthe second end securement section. Thus, the first end securementsection 1022 may be at least about 1.25 mm long, as measured from theadjacent edge 1032 of gap 1018 to the end 1034 of strip 1006 boundingthe first end securement section 1022. The bump contact 1012 1014 isdisposed on the first end securement section 1022.

The gap 1020 in underlayer 1016 is slightly larger than the gap 1018 indielectric support layer 1002. Gap 1020 is partially aligned with gap1018 so that gap 1020 encompasses the connection section 1026 of thestrip and also encompasses the second end securement section 1024. Thus,the first end securement section 1022 remains engaged between underlayer1016 and support layer 1002 whereas the second end securement section1024 is exposed through gap 1000. In the next stage of the process (FIG.21h) the residual portion of copper layer 1004 remaining on the strip1006 is removed in the connection portion 1026 of the strip, leaving thelead with first end securement section 1022, connection section 1026 andsecond end securement section 1024. Because second end securementsection 1024 is connected to the dielectric support layer 1002 over onlya very short length, and hence a very small area, and because the secondend securement section 1024 is unsupported by the underlayer 1016, thesecond end securement section can be detached readily from the supportlayer when the connection section 1026 is engaged by a bonding tool.Conversely, the first end securement section is securely bonded to thedielectric support layer 1002 over a substantial length, and issupported by the underlayer 1016, so that the first end securementsection is substantially permanently connected to the dielectric supportlayer.

In all of the embodiments illustrated above, the connection sections ofthe leads are bonded to contacts on the chip. However, similarcomponents and methods can be used for bonding to a substrate or toanother component of a semiconductor chip assemblage. Such a variant isschematically shown in FIG. 22. The connection component 1200 has adielectric supporting structure 1202 similar to those discussed above.The supporting structure 1202 defines gaps 1204. Numerous leads areprovided, which only a few are shown in FIG. 22. Each lead has aconnection section 1206 which, prior to assembly, extends across a gap1204. Each lead also has a terminal 1208 remote from gap 1204. In theassembly procedure, the terminals 1208 are connected to terminals on asemiconductor chip 1210 whereas the connection sections 1206 of theleads are connected to contacts 1212 on a chip mount, hybrid circuitpanel or other supporting substrate 1214. The configurations of theconnection sections 1206 may be similar to any of those discussed above.Also, the bonding procedures used for bonding the connection sections tothe contacts of the substrate may be essentially the same as thosediscussed above with reference to bonding to a chip. According to yet afurther variant (not shown) the terminals 1208 may be replaced by afurther set of connection sections and further gaps in the supportingstructure. In this arrangement, each individual lead has two separateconnection sections extending across two separate gaps in the supportingstructure. The leads and gaps are configured so that when the connectioncomponent is disposed on an assemblage of a chip and substrate, one setof connection sections is positioned atop contacts on the chip, whereasanother set of connection sections, and the associated gaps, arepositioned atop contacts on the substrate. In this arrangement, thebonding procedures discussed above may be used both for bonding theleads to the chip and for bonding the leads to the substrate.

A tape 1300 including a plurality of components in accordance withanother embodiment of the invention is schematically depicted in FIG.23. The tape includes a plurality of components each incorporating asupport structure 1330. The support structure of each componentincorporates a flexible, sheetlike dielectric layer 1332 as discussedabove and may also include a soft, compliant layer similar to thosediscussed above, the compliant layer lying beneath the flexibledielectric layer 1332. The support structure of each component has gaps1340 extending through it from its top surface to its bottom surface soas to subdivide the support structure into an interior or centralportion 1342 and an outer or peripheral portion 1344. The gaps mergewith one another so that the central or interior portion 1342 of eachcomponent is not connected to the outer or peripheral portion of thesupport structure by any other portion of the support structure. Rather,as discussed below, the central portion 1342 is temporarily connected tothe outer or peripheral portion 1344 of the support structure by theleads extending across gaps 1340.

The support structures of numerous components are formed as parts of thesame continuous tape 1300. The outer or peripheral portions 1344 of thesupport structures of the various components, and particularly the outeror peripheral portions of the top dielectric layers 1332 are formed asparts of the same continuous piece of flexible dielectric filmincorporated in the tape. The tape may be provided with features, suchas the sprocket holes 1335, to facilitate feeding and movement of thetape in production processes.

Each component in accordance with this embodiment has a plurality ofelongated electrically conductive buses 1353 extending on the peripheralportion 1344 of the top dielectric layer alongside slots 1340 so thatone such bus extends alongside of, and substantially codirectionallywith, each such slot. The buses 1353 of each component form a generallyrectilinear, hooplike structure encircling the gaps 1340 and the centralportion 1342 of the support structure. Each component further hasterminals 1348 disposed on the central portion 1342 of the supportstructure and a plurality of leads 1352 extending outwardly from theterminals. Each lead 1352 includes a first end securement section 1366on central portion 1342; a connection section 1356 extending outwardlyacross one of the gaps or slots 1340 from the first end securementsection; a frangible section 1372 joined to the second or outer end 1362of the connection section and a second end securement section 1370joining the frangible section to the bus 1353 lying alongside of theslot 1340. As shown in FIG. 24, the frangible sections 1372 lie justinside the outer margins of slots 1340. The connection sections of allof the leads associated with any given slot extend generallyperpendicular to the slot and generally side-by-side parallel to oneanother. In the condition illustrated, the connection sections 1356 andfrangible sections 1372 of the leads bridge gaps 1340 and physicallyconnect the central portion 1342 of the support structure with theperipheral portion 1344. Moreover, in this condition all of the leads,and hence, all of the terminals, are electrically connected to oneanother.

The dimensions and configuration of the lead will vary somewhatdepending upon the materials of construction and depending upon thedesired application. Leads having connection sections and frangiblesections formed principally or entirely from gold may be employed. Forgold or other noble metal leads with relatively small spacing betweenleads, the width w₁ or dimension between the opposed edges of the leadin the direction transverse to the length of the connection section maybe between about 15 microns and about 38 microns. The second endsecurement section 1370 may have a similar width. The frangible section1372 of each lead may be defined by a pair of notches extending inwardlyfrom the opposed edges of the lead. Each such notch may have a pair ofangularly arranged edges defining a generally V-shaped notch with anincluded angle A (FIG. 24) desirably between about 45 degrees and about120 degrees. The width w₂ of the frangible section in the notch, i.e.,the smallest dimension of the neck or frangible section in the directiontransverse to the length of the connection section may be between about5 microns and about 12 microns. Most preferably, the leads, includingthe connection sections have a thickness or vertical extentperpendicular to the plane of the dielectric layer 1332 (perpendicularto the plane of the drawings in FIGS. 23 and 24) of about 10 to about 30microns and most desirably about 25 microns. Preferably, each bus 1353has a width w₃, i.e., the dimension transfers to the length of the bus,of at least about 50 microns and more preferably between about 50 andabout 200 microns and a thickness of about 10 to about 30 microns andmore preferably about 25 microns.

Components as illustrated in FIG. 23 and 24 may be formed by processessimilar to those discussed above. Preferably, the process starts with alaminate including flexible layer 1330 with a thin film of copperdeposited on the top surface. A photoresist is deposited on the copper,exposed to illumination in a pattern corresponding to the negativepattern of the desired leads and then subjected to processes to developthe photoresist. The undeveloped photoresist is then removed and a layerof gold in the thickness desired for the leads and buses is then platedon the copper in the areas left uncovered. This photoresist is thenremoved and the part is subjected to an etching process which removesthe copper layer in those areas not covered by the gold of the buses andleads. Using a further mask, terminals 1348 are built up by furtherelectroplating. In this electroplating process, the buses 1353 and leads1352 provide electrical connections to the terminals 1348. Then, slotsor gaps 1340 are formed by chemical etching or by laser etchingdielectric film 1330. Formation of the slots or gaps leaves the lowersurfaces of connection sections 1356 and frangible sections 1372, withportions of the initial copper layer thereon exposed. The component isthen subjected to a further etching procedure to remove the copper fromthe lower surfaces of these parts, so that the connection sections andfrangible sections are essentially devoid of copper. Some copper,however, is left beneath the first end attachment section 1366 andsecond end attachment section 1370 of each lead, and beneath each bus1353, serving to anchor those parts to layer 1330. The component may beprovided with the compliant layer 1334 beneath layer 1330 either at thispoint in the manufacturing process or when the component is assembled tothe semiconductor chip.

The component of FIGS. 23-25 may be employed with a semiconductor chip1398 (FIG. 25) similar to those discussed above. Thus, the component isjuxtaposed with the chip so that the central portion 1342 of the supportstructure overlies the central region of the chip, leaving slots 1340and connection sections 1356 of the leads aligned with contacts 1301 onthe chip. Compliant layer 1334 bears on the chip 1398. A support or ring1304 encircling the chip may be provided to support the peripheralportion 1344 of the support structure. Leads 1356 are connected tocontacts 1301 on the front face of the chip by a sequential bondingprocess similar to those discussed above. Thus, a bonding tool (notshown) is advanced downwardly into each slot 1340 so as to bond a leadto one contact, and the tool is then shifted sequentially along the slotwith sequential bonding of various leads to the chip. During the bondingstep, as the bonding tool engages each lead and forces it downwardly,the load applied to fracture the frangible section is distributed by thebus or a wide region of the support structure peripheral portion. Thistends to maintain the second end securement section 1370 of each leadsecurely in position and thereby facilitates breakage of the frangiblesections 1372. During the beginning part of this process, the centralregion 1340 of the support structure is held in place by the peripheralportion 1344 and by the leads connecting the central portion 1342 to theperipheral portion. Although each lead in and of itself is fragile, allof the leads together effectively secure the central portion in place.Buses 1353 substantially reinforce and stabilize the leads, and help tomaintain the precise spacings between adjacent leads. As each lead isforced downwardly and bonded to the contact on the chip, its frangiblesection 1372 is broken thereby detaching the second end 1362 of itsconnection section 1356 from the bus, from the second end securementsection 1370 of the lead and from the peripheral portion 1344 of thesupport structure. Thus, as the process continues the central portion isprogressively detached from the peripheral portion and attached to thecontacts of the chip. At each time during the process, however, thecentral portion is effectively held in place by the leads--first by theattachments of the leads to the peripheral portion, then by attachmentsof some leads to the peripheral portion and others to the chip andfinally by attachment of the leads to the chip, leaving the centralportion detached from the peripheral portion. After the bonding process,the peripheral portion may be processed to reclaim the gold present inthe buses.

During the lead-bonding operation, it may be desirable to crumple eachlead slightly by displacing the tool, and the section of the leadengaged therewith, towards the fixed or permanently connected end of thelead during the downward displacement and bonding steps, so as to formeach lead into a generally S-shaped structure. This serves to limit oreliminate downward pull of the leads on the edge of the central orpermanent portion of the connection component.

Also, the bonding tool may be provided with guide surfaces capable ofengaging and aligning leads extending in either of two orthogonaldirections. Thus, instead of the generally blade-like tool illustratedin FIGS. 5-8 hereof, the tool may have a generally square lower end. Thetool body may likewise define two orthogonal first and second axesextending through a central or bonding region of the lower end in firstand second horizontal directions. The guide surfaces may include a pairof first guide surfaces extending generally along the first axis, eachsuch first guide surface flaring progressively outwardly, away from thefirst axis, with progressively increasing distance from the bondingregion. Likewise, the body may further define a pair of second guidesurfaces extending along the second axis and flaring progressivelyoutwardly, away from the second axis, with increasing distance from thebonding region. The first and second guide surfaces may be generally inthe form of partial surfaces of revolution about the first and secondaxes.

As these and other variations, combinations and modifications of thefeatures discussed above can be employed without departing from thepresent invention, the foregoing description of the preferredembodiments should be taken by way of illustration rather than by way oflimitation of the present invention as defined by the claims.

What is claimed is:
 1. A method of making connections to a part of asemiconductor chip assembly characterized by the steps of:(a)juxtaposing a connection component with the chip(1) so that a bottomsurface of a support structure in said connection component confronts afront surface of a first part of such assembly having elongated rows ofcontacts on such surface, (2) so that said elongated rows of contactsare aligned with elongated slots in such support structure, saidelongated slots being connected to one another to form a substantiallycontinuous channel extending around a central portion of the supportstructure and separating the central portion from a peripheral portionof the support structure, and (3) so that connection sections of leadson said connection component extending across such elongated slots aredisposed above said contacts on such front surface of such first part,the central portion of said support structure being connected to theperipheral portion of said support structure solely through said leads,said support structure supporting each said connection section at bothsides of each such elongated slot during the juxtaposing step; and (b)bonding each said connection section to a contact on said first part bydisplacing such connection section downwardly into one of said elongatedslots so as to displace one end of each said connection sectiondownwardly relative to the support structure, so as to detach each saidconnection section from said peripheral portion of said supportstructure, and so as to bring the connection section into engagementwith such contact, whereby the central portion of said support structureis detached from the peripheral portion of said support structure duringsaid bonding step.
 2. A method as claimed in claim 1 wherein saidbonding step includes the step of breaking a frangible portion of eachsaid lead so as to detach one end of each connection section from saidsupport structure by forcing the connection section downwardly with saidbonding tool.
 3. A method as claimed in claim 1 wherein said bondingstep is performed so as to detach the connection portion of said leadsfrom said peripheral section and bond said leads to the contacts on thepart in sequence, so that each lead is bonded to the contacts on thepart before the next lead is detached from the peripheral portion,whereby the central portion of the support structure initially isconnected to the peripheral portion through the connection sections ofthe leads, and then is connected by some leads to the peripheral portionand by other leads to the contact bearing part of the assembly andfinally is severed from the peripheral portion.
 4. A method as claimedin claim 1 or claim 3 wherein said connection component includes anelongated metallic bus extending alongside of each said slot, andwherein said bus reinforces the support structure of the connectioncomponent prior to and during said bonding step.
 5. A method as claimedin any one of claim 2 or claim 1 or claim 3 wherein said bonding stepincludes the step of engaging each said connection section with a recessin a bonding tool so that said bonding tool at least partiallyconstrains the connection section during said downward displacement. 6.A method as claimed in any one of claim 2 or claim 1 or claim 3 whereinsaid first part is a semiconductor chip and said connection sections ofsaid leads are bonded to contacts on said chip in said bonding step. 7.A method as claimed in claim 1, wherein said bonding step includes thestep of breaking a frangible portion of each lead so as to detach oneend of each connection section from said support structure by forcingthe connection section downwardly.
 8. A method as claimed in claim 7wherein said connection component includes an elongated metallic busextending alongside of each said slot adjacent to the frangible portionsof the leads, and wherein said bus reinforces the support structure ofthe connection component prior to and during said bonding step.
 9. Amethod of making a semiconductor connection component comprising thesteps of:(a) forming a plurality of leads having frangible sectionsadjoining elongated connection sections, said leads being supported onboth sides of said frangible section by a dielectric support layer, saidelongated connection sections extending codirectionally, side by sidewith one another and having their frangible sections aligned with oneanother; (b) forming an elongated conductive bus extending transverse tothe connection sections of said leads and connected thereto through saidfrangible sections, said step of forming said conductive bus beingperformed concurrently with said step of forming said leads; and (c)said dielectric support layer in contact with said lead by selectivelyremoving a part of said dielectric layer to form a gap therein so thatsaid gap is aligned with said connection section and said frangiblesection.
 10. A method as claimed in claim 9, further characterized inthat the forming and treating steps are performed so that saidconnection section is permanently secured to said dielectric supportlayer on a first side of said gap and releasably secured to saiddielectric support layer on a second side of said gap.
 11. A method asclaimed in claim 10, further characterized in that said conductive busis formed on said second side of said gap.
 12. A method as claimed inclaim 9, further characterized by the step of electroplating componentson the semiconductor connection component, wherein said leads and saidconductive bus provide electrical connections to said components.
 13. Amethod of making connections to a part of a semiconductor chip assemblycharacterized by the steps of:(a) juxtaposing a connection componentwith the chip so that a bottom surface of a support structure in saidconnection component confronts a front surface of a first part of suchassembly having at least one elongated row of contacts on such surface,so that each said elongated row of contacts is aligned with a gap insuch support structure and so that a plurality of connection sections ofleads on said connection component extending across said gap is disposedabove one of said elongated rows of contacts, said support structuresupporting each said connection section at both sides of said gap duringthe juxtaposing step; and (b) bonding each said connection section to acontact on said first part by displacing such connection sectiondownwardly into the gap so as to displace said one end of each saidconnection section downwardly relative to the support structure andbring the connection section into engagement with such contact andbreaking a frangible portion of each said lead so as to detach one endof each said connection section from said support structure; saidconnection component including an elongated metallic bus extendingalongside said gap adjacent to the frangible portions of said leads,said bus reinforcing the support structure of the connection componentprior to and during said bonding step.
 14. A method as claimed in claim13 further characterized in that said gap comprises a single elongatedslot, and said elongated metallic bus comprises a single strip extendingalongside said slot.
 15. A method as claimed in claim 13 furthercharacterized in that said gap comprises a plurality of elongated slotsconnected to one another to form a substantially continuous channelextending around a central portion of the support structure andseparating the central portion from a peripheral portion of the supportstructure so that prior to said bonding step the central portion isconnected to the exterior portion solely through said leads, said stepof detaching one end of each said connection section being performed soas to detach each said connection section from said central section,whereby the interior section is detached from the peripheral sectionduring said connection step.
 16. A method as claimed in claim 15 whereinsaid elongated metallic bus comprises a strip on said peripheral sectionextending around said substantially continuous channel.
 17. A method asclaimed in claim 15 wherein said bonding step is performed so as todetach the connection sections of said leads from said peripheralsection and bond said leads to the contacts on the part in sequence, sothat each lead is bonded to the contacts on the part before the nextlead is detached from the peripheral section, whereby the centralportion of the support structure initially is connected to theperipheral portion through the connection sections of the leads, andthen is connected by some leads to the peripheral portion and by otherleads to the contact bearing part of the assembly and finally is severedfrom the peripheral portion.
 18. A method of making a semiconductorconnection component comprising the steps of:(a) forming a plurality ofleads having frangible sections adjoining elongated connection sections,said leads being supported on both sides of said frangible section by adielectric support layer, said elongated connection sections extendingcodirectionally, side by side with one another and having theirfrangible sections aligned with one another; (b) forming an elongatedconductive bus extending transverse to the connection sections of saidleads and connected thereto through said frangible sections; and (c)electroplating components on the semiconductor connection component,wherein said leads and said conductive bus provide electricalconnections to said components.
 19. The method as claimed in claim 18,wherein said steps of forming a plurality of leads and forming anelongated conductive bus are performed concurrently.
 20. The method asclaimed in claim 18, further comprising the step of selectively removinga part of said dielectric layer to form a gap therein before or aftersaid step of forming said leads so that said gap is aligned with saidconnection section and said frangible section.